PATEO pioneered the Internet of Vehicles (IoV) industry and has achieved many "firsts" in succession,
continuously leading the development of the automotive intelligence industry.
Unveiled China’s first 3G vehicle connectivity system
Launched our QingCloud 1.0 advanced cloud service platform, supporting a comprehensive range of cloud-based vehicle connectivity services
Included in Headquarters of Private Companies by Shanghai Municipal Commission of Commerce, Shanghai Municipal Development and Reform Commission, Shanghai Municipal Commission of Economy and Informatization and Shanghai Federation of Industry and Commerce
Included in Forbes China’s Unicorn List
Named as a National Intellectual Property Leading Enterprise by China National Intellectual Property Administration
Found a joint laboratory focused on setting standards for verification, validation and testing of domestic automotive-grade chips with the National New Energy Vehicle Technology Innovation Center of China
The predecessor of the Company, Botai Yuezhen Electronic Equipment Manufacturing was established in the PRC in October
Introduced the first ever automotive-grade operating system developed by a private-owned enterprise in China
Jointly developed the first Dongfeng Aeolus WindLink 3.0 intelligent vehicle connectivity system
Two of our proprietary technological innovations related to smart cockpit solutions and intelligent vehicle connectivity solutions were acknowledged as internationally leading technologies by the National New Energy Vehicle Technology Innovation Center of China
Recognized as a National Enterprise Technology Center by National Development and Reform Commission, Ministry of Finance of the PRC, General Administration of Customs of the PRC and State Taxation Administration
Included in Shanghai Headquarters of Innovative Companies by Shanghai Municipal Leading Group Office for Strategic New Industries
Became one of the first companies to offer smart cockpit solutions powered by Qualcomm’s fourth generation Snapdragon 8295 chipset in China, which are among the latest-generation automotive-grade chips for smart cockpit solutions with the highest computing power
The predecessor of the Company, Botai Yuezhen Electronic Equipment Manufacturing was established in the PRC in October
Unveiled China’s first 3G vehicle connectivity system
Introduced the first ever automotive-grade operating system developed by a private-owned enterprise in China
Launched our QingCloud 1.0 advanced cloud service platform, supporting a comprehensive range of cloud-based vehicle connectivity services
Jointly developed the first Dongfeng Aeolus WindLink 3.0 intelligent vehicle connectivity system
Included in Headquarters of Private Companies by Shanghai Municipal Commission of Commerce, Shanghai Municipal Development and Reform Commission, Shanghai Municipal Commission of Economy and Informatization and Shanghai Federation of Industry and Commerce
Two of our proprietary technological innovations related to smart cockpit solutions and intelligent vehicle connectivity solutions were acknowledged as internationally leading technologies by the National New Energy Vehicle Technology Innovation Center of China
Included in Forbes China’s Unicorn List
Recognized as a National Enterprise Technology Center by National Development and Reform Commission, Ministry of Finance of the PRC, General Administration of Customs of the PRC and State Taxation Administration
Named as a National Intellectual Property Leading Enterprise by China National Intellectual Property Administration
Included in Shanghai Headquarters of Innovative Companies by Shanghai Municipal Leading Group Office for Strategic New Industries
Found a joint laboratory focused on setting standards for verification, validation and testing of domestic automotive-grade chips with the National New Energy Vehicle Technology Innovation Center of China
Became one of the first companies to offer smart cockpit solutions powered by Qualcomm’s fourth generation Snapdragon 8295 chipset in China, which are among the latest-generation automotive-grade chips for smart cockpit solutions with the highest computing power
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