On June 17, 2026, PATEO (2889.HK) and Fuyao University of Science and Technology (hereinafter referred to as “FYUST”), a new type of research university in Fujian, officially signed a cooperation agreement. At the signing ceremony, Hui Cao, Chairman of Fuyao Group, Ken (Yilun) Ying, Founder and Chairman of PATEO, and Fuli Zhang, Executive Vice President of FYUST, attended as witnesses. Jianzhong Jiang, Dean of the School of Advanced Materials and New Energy at FYUST, and Yong Ma, General Manager of the Domestic Business Department at PATEO, officially signed the cooperation agreement on behalf of both parties.

According to the agreement, both parties will conduct intensive research and development (R&D) to tackle key challenges in core material fields, including core materials for electro-optic modulators, silicon photonics integration, and fourth-generation semiconductors, with plans to commercialize their R&D achievements. This move firmly anchors the collaboration at the trillion-dollar intersection of the booming AI computing power and optical communication sectors, aiming to complete the full-link closed loop from “materials to chips to commercial applications.”

This collaboration with FYUST no longer focuses merely on pure device manufacturing, but points directly to core materials, the very source of the optical communication industry. Beyond the combination of technology and capital, both parties will also jointly apply for national, provincial, and ministerial-level scientific research projects, as well as corporate-funded R&D projects. Furthermore, they will co-build scientific research and innovation platforms to enhance the research and innovation capabilities and caliber of their joint industry-education-research laboratory.

PATEO stated that this partnership with FYUST represents another critical refinement of its optical industry ecosystem following its proposed acquisition of an optical chip company. As the collaboration materializes, PATEO’s blueprint in the optical communication field is becoming increasingly clear. This will not only consolidate its leading position in the smart cockpit sector but is also expected to carve out a brand-new growth curve against the backdrop of the explosion in AI computing power and optical communications, demonstrating its ambition to transform from a single equipment manufacturer into a “technology + industry” platform-based company.