On August 7, PATEO announced its acquisition of an approximately 70% equity stake in Chengdu Mingyi, a domestic high-performance communication chip design enterprise, for a consideration not exceeding RMB 1.4 billion. This transaction represents PATEO’s first major industrial merger and acquisition since its listing, marking a substantive step for the “Chip” component of the company’s “Software, Hardware, Chip, and Cloud” integration strategy, while also making a critical move for the future blueprint of the deep integration between AI and automobiles.

Chengdu Mingyi is a communication chip design enterprise that adopts a fabless model, primarily engaged in the R&D, design, and sales of products such as high-speed optoelectronic chips, high-performance analog chips, and modules. It is one of the very few domestic enterprises capable of mass-producing single-channel 100G TIA electrical chips which, applied in 400G/800G optical modules, address a critical link in the high-speed interconnectivity of computing power within AI data centers, possessing the potential to fully replace internationally leading communication chips. The performance indicators of its RF front-end chips are benchmarked against top global manufacturers, placing it in an industry-leading position.

From the overall perspective of PATEO’s “Software, Hardware, Chip, and Cloud” integration strategy, this acquisition completes its core capabilities in the chip component, providing a more solid underlying support for its technical systems in areas such as smart cockpits, in-vehicle AI agents, and physical AI world models.